Core Abrasive
High hardness, excellent wear resistance, sharp cutting performance, and stable physical and chemical properties. Our abrasive materials deliver consistent quality, precise particle size, and reliable performance for demanding industrial applications.
White Fused Alumina
Brown Fused Alumina
Black Silicon Carbide
Green Silicon Carbide
High-purity white fused alumina with excellent hardness, wear resistance, and sharp cutting performance for blasting, grinding, and polishing.
High toughness, excellent wear resistance, and strong impact resistance, ideal for grinding and abrasive applications.
High hardness, sharp cutting performance, and excellent thermal conductivity, ideal for grinding, polishing, and surface treatment.
Higher purity and hardness than black silicon carbide, with excellent thermal conductivity, designed for carbide, optical glass, and wafer cutting and grinding.
Flexible Deburring Medium
Natural Plant Abrasive
Biodegradable natural abrasives do not damage the workpiece substrate and are suitable for gentle cleaning, dry polishing, and degreasing.
Walnut Shell Abrasive
Corn Cob Abrasive
Natural soft granules that do not damage metal surfaces are commonly used for cleaning carbon deposits in engines and deburring precision jewelry.
With good absorption and moderate wear resistance, it is used for tumbling, drying, degreasing and surface polishing of metal and plastic workpieces.
Ultra-precision Polishing Series
Oxides and Superhard Micro Powder
The precisely controlled particle size distribution provides a scratch-free polishing solution for precision optics, electronic semiconductors, and gemstone grinding.
Alumina Powder
Cerium Oxide Powder
Zirconia Beads
Diamond Powder
High purity, fine particle size, excellent hardness and chemical stability, ideal for precision polishing, ceramics, and advanced materials.
Its strong chemical-mechanical polishing performance makes it ideal for high-efficiency polishing of LCD glass, optical lenses, and automotive glass.
High density, excellent wear resistance, and low wear loss, ideal for high-efficiency grinding, dispersion, and ultra-fine powder processing.
With ultra-high hardness and cutting efficiency, it is specially designed for ultra-precision polishing of cemented carbide, gemstones, and semiconductor wafers.
